Nickel(ii)sulfamate tetrahydrate

• CAS: 124594-15-6
• Catalog Number: ACM124594156-2
• Category: Main Products
• Molecular Weight: 322.9g/mol
• Molecular Formula: H12N2NiO10S2
• IUPAC Name: nickel(2+);disulfamate;tetrahydrate
• Canonical SMILES: NS(=O)(=O)[O-].NS(=O)(=O)[O-].O.O.O.O.[Ni+2]
• InChI: InChI=1S/2H3NO3S.Ni.4H₂O/c2*1-5(2,3)4;;;;;/h2*(H3,1,2,3,4);;4*1H2/q;;+2;;;;/p-2
• InChI Key: TXRHHNYLWVQULI-UHFFFAOYSA-L
• Appearance: Solid
• Complexity: 79.2
• Covalently-Bonded Unit Count: 7
• Exact Mass: 321.928679g/mol
• Formal Charge: 0
• H-Bond Acceptor: 12
• H-Bond Donor: 6
• Heavy Atom Count: 15
• Monoisotopic Mass: 321.928679g/mol
• Rotatable Bond Count: 0

Case Study

Nickel Sulfamate Tetrahydrate for the Preparation of Nanocrystalline Nickel Films

Ibáñez, A., et al. Surface and Coatings Technology, 2012, 212, 94-100.

The production of metallic nanocrystalline materials, such as nickel electrodeposited thin films, can be achieved by pulse electroplating. This work evaluates the dependence of the structural and mechanical properties of nickel deposits on the electrolysis conditions. The results show that the crystal orientation of pulsed nickel films is affected by different deposition procedure parameters, which can be used to tailor thin films with good mechanical properties for various technological applications.
Preparation procedure for nickel electrodeposits
· The nickel electrodeposits are obtained from a sulfamate-type plating bath consisting of nickel sulfamate tetrahydrate, nickel chloride dihydrate, and boric acid. Boric acid was included for its buffering capacity, while NiCl2 enhanced both the anodic and cathodic reactions. The temperature was set to 55°C and the pH was measured at 3.8. No additives were used in the solution, as they tend to contaminate the deposit with sulfur and carbon, leading to embrittlement despite producing deposits with a finer grain size.
· The electrodeposition process took place in a standard electrochemical cell with a two-electrode setup, consisting of an 18/8 stainless steel plate cathode and a pure nickel foil anode. Electrodeposition was carried out galvanostatically with continuous stirring using a PAR 363 potentiostat/galvanostat connected to a PAR 175 universal programmer to regulate the parameters of the pulsed currents.

Application of Nickel Sulfamate Tetrahydrate in Chemical Nickel Plating Process

Mazur, K., A. et al. Materials Science, 2018, 54, 387-394.

Nickel electroplating process can be used to improve various properties of the substrate, such as preventing corrosion, increasing hardness and strength, and improving wear resistance. The four commonly used plating solutions in the nickel electroplating process include Watt type, chloride, fluoroborate and sulfamate. This work investigates the possibility of selecting nickel stainless steel processing technology and can save up to 100 seconds of production time.
Electrochemical nickel-plating process procedure
· The tests were conducted on AMS-5510 austenitic stainless steel using an electrochemical nickel-plating process involving various steps. The sequence of these steps is as follows: I - degreasing of the anode; III - degreasing of the cathode; V - activation of the cathode; VII - nickel plating; IX - sulfamic nickel; II, IV, VI, VIII; X - rinsing with municipal water. Each step represents a specific stage of the nickel coating process, with a standard cycle consisting of ten treatments.
· Anode degreasing is carried out in the first bath using Slotoclean EL 210 aqueous solution, while rinsing with municipal water is performed every other bath. Cathode degreasing in Slotoclean EL-211 solution takes place in the third bath, and subsequent step involve cathode activation.
· Bath VII consists of a mixture of nickel chloride (II) hexahydrate, pure hydrochloric acid, and deionized water. The final step involves electrochemical nickel plating in a bath containing a mixture of 60% nickel sulfamate, nickel chloride (II) hexahydrate, boric acid, and deionized water. Samples are plated with nickel using different current settings based on the tube diameter.

Custom Q&A

What is the molecular formula of Nickel(II) sulfamate tetrahydrate?

The molecular formula is H12N2NiO10S2.

What are some synonyms for Nickel(II) sulfamate tetrahydrate?

Some synonyms include nickel(ii)sulfamate tetrahydrate, nickel(2+);disulfamate;tetrahydrate, and Sulfamic acid, nickel(2+) salt (2:1), tetrahydrate.

What is the molecular weight of Nickel(II) sulfamate tetrahydrate?

The molecular weight is 322.9 g/mol.

What is the IUPAC name of the compound?

The IUPAC name is nickel(2+);disulfamate;tetrahydrate.

What is the InChI key of Nickel(II) sulfamate tetrahydrate?

The InChI key is TXRHHNYLWVQULI-UHFFFAOYSA-L.

What is the Canonical SMILES of the compound?

The Canonical SMILES is NS(=O)(=O)[O-].NS(=O)(=O)[O-].O.O.O.O.[Ni+2].

What is the CAS number of Nickel(II) sulfamate tetrahydrate?

The CAS number is 124594-15-6.

How many hydrogen bond donor counts does Nickel(II) sulfamate tetrahydrate have?

It has 6 hydrogen bond donor counts.

How many hydrogen bond acceptor counts does Nickel(II) sulfamate tetrahydrate have?

It has 12 hydrogen bond acceptor counts.

How many covalently-bonded unit counts does Nickel(II) sulfamate tetrahydrate have?

It has 7 covalently-bonded unit counts.