Polyamide resin

• CAS: 63428-84-2
• Catalog Number: ACM63428842-6
• Category: Other Products
• Synonyms: Nylon fibers;Polyamide fibers;Polyamide;Polyamide resin;Polyamide resin No.600;Polyamide resin,low molecular weight 651;Polyamide resin,low molecular weight 650;Polyamide multipolymer

Case Study

Preparation of thermosetting conductive adhesive with polyamide resin as curing agent

Dang, Zhi-Min, et al. Journal of Applied Polymer Science 126.3 (2012): 815-821.

Thermosetting conductive adhesive (TCA) is composed of epoxy resin as the matrix, copper microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, low molecular weight polyamide resin as the curing agent, and other additives. A new liquid curing agent was creatively reported, which successfully solved the problem of limiting the amount of conductive filler in the preparation process of TCA. Therefore, the application of this liquid curing agent greatly reduced the resistivity of TCA while maintaining sufficient bonding strength. Antioxidant and mixed copper particles were developed as conductive fillers to replace expensive silver. The results showed that the optimal preparation conditions of the conductive adhesive were 16 wt% epoxy resin, 8 wt% polyamide resin, 65 wt% Cu microparticles and nanoparticles, 1.3 wt% silane coupling agent, and 9 wt% other additives. The curing time of the additives at 60°C was 4 hours. The bonding strength reached 16.7 MPa, and the volume resistivity was less than 3.7 10X cm. The volume resistivity change was less than 15% at high temperature (100°C).
The conductive adhesive is composed of epoxy resin matrix, conductive filler, curing agent and other additives. The conductive filler includes nano-sized and micron-sized Cu particles. A certain amount of copper particles is placed in a beaker containing 2% silane coupling agent and 30 mL ethanol and modified with an ultrasonic cell crusher. After drying in a vacuum oven, the Cu particles, drying epoxy resin and formaldehyde are mixed in different proportions. The solution is stirred and then dispersed with a grinder for 30 minutes. In order to remove bubbles, the mixed solution is placed in a vacuum oven for 10 minutes. The curing agent is added to the epoxy resin at a mass ratio of 50% and mixed thoroughly. Therefore, the conductive adhesive can be cured after 4 hours at 60°C.

Polyamide Enhances Flame Retardancy of Epoxy Resins

Wang, Jun-Sheng, et al. Journal of applied polymer science 108.4 (2008): 2644-2653.

An attractive intumescent flame-retardant epoxy system was prepared from epoxy resin (bisphenol A diglycidyl ether), low molecular weight polyamide (curing agent, LWPA) and ammonium polyphosphate (APP). The cured epoxy resin acts as a carbonizing agent as well as a blowing agent itself in the intumescent flame retardant formulation. The flammability and thermal stability of the cured epoxy resins with different APP and LWPA contents were investigated by limited oxygen index (LOI), UL-94 testing and thermogravimetric analysis (TGA). The LOI and UL-94 results indicate that APP can improve the flame retardancy of LWPA-cured epoxy resins. Only 5 wt% of APP can increase the LOI value of the epoxy resin from 19.6 to 27.1 and improve the UL-94 rating from no rating to V-0 rating when the epoxy resin to LWPA mass ratio is 100/40. Interestingly, the LOI value of the flame-retardant cured epoxy resin (FR-CEP) increases with decreasing LWPA. TGA, FTIR and X-ray photoelectron spectroscopy (XPS) results show that the thermal degradation process of FR-CEP consists of two main stages: the first stage is the formation of phosphorus-rich carbon on the surface of the material. Below 500 ° C, and then above 500 ° C to produce dense carbon; the second stage is that the residual carbon layer can provide more effective protection to the material than the residual carbon formed in the first stage. The flame retardant mechanism is discussed based on the TGA, FTIR and XPS results of FR-CEP.
Cured epoxy resin is obtained by thermal curing. The reactants and epoxy resin are mixed in a certain equivalent ratio (100/30, 100/35, 100/40, 100/45 and 100/50). Then different contents (0, 5, 7.5, 10, 12.5, 15wt%) of APP are added to the reactants respectively to form a series of mixtures under stirring. Finally, the mixture is cured at room temperature for 12 hours and at 80 ° C for 5 hours to obtain a solid product.