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Structure

Germanium single crystal disc, 10mm (0.39in) dia, 1-3mm (0.04-0.1in) thick, (100) orientation, ±0.5°

CAS
7440-56-4
Catalog Number
ACM7440564-2
Category
Pure Element Single Crystals
Molecular Weight
72.63g/mol
Molecular Formula
Ge

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Specification

Description
PelletsLargeCrystals, WetSolid, OtherSolid
IUPAC Name
germanium
Canonical SMILES
[Ge]
InChI
InChI=1S/Ge
InChI Key
GNPVGFCGXDBREM-UHFFFAOYSA-N
Boiling Point
2700 °C
Melting Point
937.2 °C
Density
5.323 @ 25 °C/4 °C
Solubility
INSOL IN WATER, HYDROCHLORIC ACID, DIL ALKALI HYDROXIDES;SOL IN HOT SULFURIC ACID, AQUA REGIA; INSOL IN ALKALI
Application
The Germanium single crystal disc, with its precise dimensions and (100) orientation, is engineered to harness the unique properties of germanium for advanced applications. This product serves as a vital component in the electronics industry, particularly in the manufacturing of rectifying devices such as germanium diodes and transistors. Its exceptional capability to transmit infrared radiation makes it indispensable in optical systems, including lenses and filters for infrared detection and guidance systems. Furthermore, the disc's integration into specialized alloys and glass production enhances its versatility, allowing for the creation of materials with superior refractivity and dispersion qualities, critical for wide-angle camera lenses and high-precision microscopes.
Color/Form
GRAYISH-WHITE, LUSTROUS, BRITTLE METALLOID; DIAMOND-CUBIC STRUCTURE WHEN CRYSTALLINE
Complexity
0
Covalently-Bonded Unit Count
1
EC Number
231-164-3
Exact Mass
73.921178g/mol
Formal Charge
0
H-Bond Acceptor
0
H-Bond Donor
0
Heat of Vaporization
3.5733X10+8 J/kmol @ melting point
Heavy Atom Count
1
Monoisotopic Mass
73.921178g/mol
Other Experimental
THERMAL EXPANSION COEFFICIENT AT APPROX 25 °C: 6.1X10-6 °C; THERMAL CONDUCTIVITY @ 25 °C: 0.14 CAL/SEC CM/DEG C; SPECIFIC HEAT (0-100 °C): 0.074 CAL/G/DEG C;LATTICE CONSTANT @ 25 DEG: 5.657X10-8 CM; VOL COMPRESSIBILITY: 1.3X10-12 SQ CM/DYN; DIELECTRIC CONSTANT: 16; MAGNETIC (MASS) SUSCEPTIBILITY (CHI X10+6)= -0.12;COVALENT BOND IONIZATION ENERGY @ 0 DEG K= 1.2 ELECTRON VOLT; BAND GAP: 0.67 ELECTRON VOLT; ATOMS/CC= 4.42X10+22; IMPURITY ATOM IONIZATION ENERGY: APPROX 0.01 ELECTRON VOLT; INTRINSIC RESISTIVITY @ 300 DEG K= 47 OHM-CM;ELECTRON MOBILITY @ 300 DEG K: 3900 SQ CM/V SEC; HOLE MOBILITY @ 300 DEG K= 1900 CM/V SEC; HOLE DIFFUSION CONSTANT @ 300 DEG K= 49;INTRINSIC CHARGE DENSITY @ 300 DEG K= 2.4X10+13; ELECTRON DIFFUSION CONSTANT @ 300 DEG K= 100;IS HIGHLY TRANSPARENT TO INFRARED LIGHT; HAS A HIGH INDEX OF REFRACTION;THE METAL & MANY OF ITS ALLOYS EXPAND ON SOLIDIFICATION;FIVE NATURALLY OCCURRING ISOTOPES: 70 (20.55%); 72 (27.37%); 73 (7.67%); 74 (36.74%); 76 (7.67%); ATOMIC NUMBER 32;POOR CONDUCTOR OF ELECTRICITY; VOL SMALLER BY FEW % WHEN MOLTEN; ATTACKED BY AQUA REGIA, CONCN NITRIC OR SULFURIC ACIDS, FUSED ALKALIES, ALKALI PEROXIDES, NITRATES, OR CARBONATES;HARDNESS 6 ON MOHS SCALE;Liquid molar volume = 0.013001 cu m/kmol determined at the triple point.;IG heat of formation = 3.766X10+8 J/kmol (ideal gas); for the crystal the enthalpy of formation is 0 at 298.15 K.;Heat of fusion at melting point = 3.18X10+7 J/kmol.
Rotatable Bond Count
0
Stability
RELATIVELY STABLE, UNAFFECTED BY AIR, BECOMES OXIDIZED ABOVE 600 °C
UNII
619P6J82AE;00072J7XWS
Vapor Pressure
0 mm Hg @ 25 °C
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