12005-86-6 Purity
99%+
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Specification
A coating filler
Tungsten boride can be used as filler to prepare a tungsten boride-rich coating with high adhesion.
The molecular formula of tungsten boride is BW.
The molecular weight of tungsten boride is 194.65 g/mol.
The component compounds of tungsten boride are tungsten (CID 23964) and boron (CID 5462311).
Tungsten boride was created on August 8, 2005.
Tungsten boride was last modified on December 2, 2023.
The IUPAC name of tungsten boride is boranylidynetungsten.
The InChI of tungsten boride is InChI=1S/B.W.
The InChIKey of tungsten boride is JEEHQNXCPARQJS-UHFFFAOYSA-N.
The CAS number of tungsten boride is 12007-09-9.
Yes, tungsten boride is a canonicalized compound.