Copper Nanofoil

• CAS: 7440-50-8
• Catalog Number: ACM7440508-8
• Category: Nanofoil
• Molecular Weight: 63.55g/mol
• Molecular Formula: Cu
• Description: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.
• Synonyms: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
• IUPAC Name: copper
• Canonical SMILES: [Cu]
• InChI: InChI=1S/Cu
• InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N
• Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016);2595 °C;2595 °C;4703°F;4703°F
• Melting Point: 1981 °F (NIOSH, 2016);1083 °C;1083 °C;1981°F;1981°F
• Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94
• Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
• Appearance: Reddish Metal
• Color/Form: Reddish, lustrous, ductile, malleable metal;Red metal; cubic
• Complexity: 0
• Covalently-Bonded Unit Count: 1
• EC Number: 231-159-6
• Electrical Resistivity: 1.673 μΩ-cm @ 20 °C
• Electronegativity: 1.90 Paulings
• Exact Mass: 62.929597g/mol
• Formal Charge: 0
• H-Bond Acceptor: 0
• H-Bond Donor: 0
• Heat of Fusion: 13.26 kJ ·mol-1
• Heat of Vaporization: 1150 cal/g
• Heavy Atom Count: 1
• ICSC Number: 0240
• LogP: -0.57 (calculated)
• MDL Number: MFCD00010965
• Monoisotopic Mass: 62.929597g/mol
• Odor: Odorless /Copper dusts and mists/
• Other Experimental: Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.
• Ratio: 0.34
• Rotatable Bond Count: 0
• RTECS Number: GL5325000
• Specific Heat: 0.39 kJ/kg K
• Stability: BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.
• Thermal Conductivity: 401 W ·m-1 ·K-1
• Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1
• UNII: 789U1901C5
• UN Number: 3089;3077
• Vapor Pressure: 0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)
• Vickers Hardness: 369 MPa
• Young's Modulus: 110-128 GPa

Custom Q&A

What is the PubChem CID of Copper Nanofoil?

The PubChem CID of Copper Nanofoil is 23978.

What is the molecular formula of Copper Nanofoil?

The molecular formula of Copper Nanofoil is Cu.

What is the molecular weight of Copper Nanofoil?

The molecular weight of Copper Nanofoil is 63.55 g/mol.

What is the synonym for Copper Nanofoil?

The synonyms for Copper Nanofoil include Copper, Cu, Copper powder, and cuprum.

How is Copper used in various products?

Copper is used to make many different kinds of products like wire, plumbing pipes, and sheet metal. It is also combined with other metals to make brass and bronze pipes and faucets.

What is the role of Copper as a micronutrient?

Copper has a role as a micronutrient, which means it is necessary for plants and animals (including humans) to live. They must absorb some copper from eating, drinking, and breathing.

What are the other identifiers for Copper Nanofoil?

The other identifiers for Copper Nanofoil include CAS number 7440-50-8 and UNII 789U1901C5.

What is the IUPAC name of Copper Nanofoil?

The IUPAC name of Copper Nanofoil is copper.

Does Copper Nanofoil have any hydrogen bond donors or acceptors?

No, Copper Nanofoil does not have any hydrogen bond donors or acceptors.

What is the molecular structure of Copper Nanofoil?

The molecular structure of Copper Nanofoil can be represented by the canonical SMILES [Cu].