Copper

• CAS: 7440-50-8
• Catalog Number: ACM7440508-9
• Category: Reference/Calibration Standards
• Molecular Weight: 63.55
• Molecular Formula: Cu
• Description: insulated wire, 0.1m, conductor diameter 0.1mm, insulation thickness 0.01mm, PTFE (polytetrafluoroethylene) insulation, 99.99%
• Synonyms: CHEBI:28694; Copper, rod, 200mm, diameter 2.0mm, as drawn, 99.99+%; Copper, wire reel, 5m, diameter 0.75mm, as drawn, 99.98+%; Copper, rod, 200mm, diameter 9.5mm, hard, 99.9%; Copper, foil, thickness 0.25 mm, length 2 m, purity 99.9%; Copper, foil, thickness 0.15 mm, size 100 x 100 mm, purity 99.9%; Copper powder, 5% in graphite; Copper - O.F.H.C., foil, 5m coil, thickness 0.1mm, hard, 99.95+%; Copper granulated; Copper, foil, thickness 0.038 mm, length 2 m, purity 99.9%
• IUPAC Name: copper
• Canonical SMILES: [Cu]
• InChI: 1S/Cu,RYGMFSIKBFXOCR-UHFFFAOYSA-N
• InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N
• Boiling Point: 4703 °F at 760 mm Hg (NIOSH, 2016)
• Melting Point: 1083.4 °C (lit.)
• Density: 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94
• Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
• Application: Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
• Storage: 2-8°C
• Assay: 99.95% trace metals basis
• Color/Form: Reddish, lustrous, ductile, malleable metal;Red metal; cubic
• Complexity: 0
• Covalently-Bonded Unit Count: 1
• Diameter: #REF!
• EC Number: 231-159-6
• Electrical Resistivity: 1.673 μΩ-cm, 20°C
• Exact Mass: 62.929597g/mol
• Form: wire
• Formal Charge: 0
• H-Bond Acceptor: 0
• H-Bond Donor: 0
• Heat of Vaporization: 1150 cal/g
• Heavy Atom Count: 1
• ICSC Number: 0240
• Length: 0.2 m
• LogP: -0.57 (calculated)
• MDL Number: MFCD00010965
• Monoisotopic Mass: 62.929597g/mol
• Octanol Water Partition Coefficient: -0.57 (calculated)
• Odor: Odorless /Copper dusts and mists/
• Other Experimental: Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.
• Packaging: 1 ea in rigid mailer
• Physical Description: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.
• Quality Level: 100
• Rotatable Bond Count: 0
• RTECS Number: GL5325000
• Stability: BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.
• Thickness: 0.01 mm
• Topological Polar Surface Area: 0A^2
• UNII: 789U1901C5
• UN Number: 3089;3077
• Vapor Pressure: 0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)

Custom Q&A

What is the molecular formula of Copper?

The molecular formula of Copper is Cu.

When was the Copper reference created?

The Copper reference was created on September 16, 2004.

What is the molecular weight of Copper?

The molecular weight of Copper is 63.55 g/mol.

What are some synonyms for Copper?

Some synonyms for Copper are Copper powder, cuprum, and 7440-50-8.

What is the role of Copper in Escherichia coli?

Copper has a role as a micronutrient and an Escherichia coli metabolite.

What is the InChIKey of Copper?

The InChIKey of Copper is RYGMFSIKBFXOCR-UHFFFAOYSA-N.

What is the CAS number of Copper?

The CAS number of Copper is 7440-50-8.

What is the EC number of Copper?

The EC number of Copper is 231-159-6.

Is Copper a hydrogen bond donor?

No, Copper does not have any hydrogen bond donor count.

Is Copper a hydrogen bond acceptor?

No, Copper does not have any hydrogen bond acceptor count.