Sharma A, Ahn B
Soldering & Surface Mount Technology, 2019
The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from alkaline stannate baths.
Chemicals Related in the Paper:
| Catalog Number | Product Name | Structure | CAS Number | Price |
|---|---|---|---|---|
| ACM12019077 | COPPER STANNATE |  |
12019-07-7 | Price |
