17980-29-9 Purity
95%+
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Specification
Substrate Functionalization with 3-Glycidoxypropyldimethoxymethylsilane
I utilized 3-Glycidoxypropyldimethoxymethylsilane from Alfa Chemistry. The epoxy-silane proved to be an excellent coupling agent for functionalizing a range of substrates.
The IUPAC Name of the compound is dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane.
The molecular formula of the compound is C9H20O4Si.
The molecular weight of the compound is 220.34 g/mol.
The InChI of the compound is InChI=1S/C9H20O4Si/c1-10-14(3,11-2)6-4-5-12-7-9-8-13-9/h9H,4-8H2,1-3H3.
The InChIKey of the compound is WHGNXNCOTZPEEK-UHFFFAOYSA-N.
The Canonical SMILES of the compound is CO[Si](C)(CCCOCC1CO1)OC.
The CAS number of the compound is 65799-47-5.
The European Community (EC) number of the compound is 265-929-8.
The hydrogen bond donor count of the compound is 0.
Yes, the compound is canonicalized.